HK-4 Series

Features

• Best use for small equipments.
• In the case of reflowing by cream solder, recommended mounting pad layout should be more than 1.3x1.1 to strengthen the bonding.
• Material ： Brass

Dimension

Lineup

MODEL	Color	Plating	Packing	Delivery time	Unit price		Action
					MOQ	LOT
HK-4-G		Au	Bulk		JPY - pcs	JPY - pcs
HK-4-G-T		Au	Reel		JPY - pcs	JPY - pcs
HK-4-S		Sn	Bulk		JPY - pcs	JPY - pcs
HK-4-S-T		Sn	Reel		JPY - pcs	JPY - pcs

Please be sure to check the following terms and conditions.